Meta is looking for an experienced ASIC Packaging Engineer, Mechanical/Thermal modeling focus for its ASIC packaging team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team.ASIC Packaging Engineer Responsibilities:As an ASIC Packaging Engineer, you will work with cross functional teams to define advanced package thermal/ mechanical specification for advanced packages 2.5d, 3D, wafer level packaging.Perform advanced package modeling for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging to ensure our ASICs meet/exceed performance and reliability targetsModel and simulate package manufacturing and assembly process for advance packaging process chip on wafer on substrate (S/L/R), silicon interposer, HBM attach, package to board SMT processYou will work with cross-functional teams from ASIC R&D and manufacturing to drive the mechanical/thermal design using advanced FEA of new ASICs, and make engineering trade offs with package warpage, stress, reliability, thermal performanceCo-work with internal silicon, architecture and system teams and externally engaged partners, ASIC design partners, foundry and OSAT and substrate vendorsPerform advanced package stress analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve package manufacturability and reliability for next generation versions of current productsPackaging materials (e.g. underfill, mold compound, solder ball metallurgy, TIM, substrate, and lid attach adhesive) characterization to support new packaging architecture and develop material models to precisely describe package physical behaviorResponsible for designing robust and reliable mechanical package architectureMinimum Qualifications:
Meta is looking for an experienced ASIC Packaging Engineer, Mechanical/Thermal modeling focus for its ASIC packaging team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team.ASIC Packaging Engineer Responsibilities:
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